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IBM to Provide Wii U Processors

by Kevin Buikema - June 7, 2011, 1:46 pm EDT
Total comments: 2 Source: <a href="http://www.engadget.com/2011/06/07/ibm-puts-watsons-brains-in-nintendo-wii-u/">http://www.engadget.com/2011/06/07/ibm-puts-watsons-brains-in-nintendo-wii-u/</a>

IBM reveals the custom Wii U multi-core processors are based on their Power Architecture technology.

A recent press release reveals that IBM will be manufacturing the new processor for Nintendo's Wii U console based on the computer company's Power Architecture technology. IBM also mentions that their embedded DRAM and Silicon insulator technologies will also feature in the 45nm processor's design.

IBM's Power Architecture family of technologies stretches back to the nineties and has been through many iterations. For example, the PowerPC architecture that eventually showed up in the processors for Nintendo's GameCube and Wii consoles was adapted from an earlier version of the technology. More recently, IBM's Watson supercomputer, designed to play and beat the world's greatest Jeopardy players, utilized 2880 multi-core processors based on the latest generation of IBM's Power Architecture processors.

Although the press release refers to the Wii U processor as multi-core, IBM did not reveal any details on the number of cores or processors that will be in the Wii U hardware, nor was there any mention of the processor's clock speed.

IBM Processors to Power the New Wii U System from Nintendo

ARMONK, N.Y., June 7, 2011 /PRNewswire/ -- IBM (NYSE: IBM) today announced that it will provide the microprocessors that will serve as the heart of the new Wii U™ system from Nintendo. Unveiled today at the E3 trade show, Nintendo plans for its new console to hit store shelves in 2012.

The all-new, Power-based microprocessor will pack some of IBM's most advanced technology into an energy-saving silicon package that will power Nintendo's brand new entertainment experience for consumers worldwide. IBM's unique embedded DRAM, for example, is capable of feeding the multi-core processor large chunks of data to make for a smooth entertainment experience.

IBM plans to produce millions of chips for Nintendo featuring IBM Silicon on Insulator (SOI) technology at 45 nanometers (45 billionths of a meter). The custom-designed chips will be made at IBM's state-of-the-art 300mm semiconductor development and manufacturing facility in East Fishkill, N.Y.

The relationship between IBM and Nintendo dates to May 1999, when IBM was selected to design and manufacture the central microprocessor for the Nintendo GameCube™ system. Since 2006, IBM has shipped more than 90 million chips for Nintendo Wii systems.

"IBM has been a terrific partner for many years. We truly value IBM's commitment to support Nintendo in delivering an entirely new kind of gaming and entertainment experience for consumers around the world," said Genyo Takeda, Senior Managing Director, Integrated Research and Development, at Nintendo Co., Ltd.

"We're very proud to have delivered to Nintendo consistent technology advancements for three generations of entertainment consoles," said Elmer Corbin, director, IBM's custom chip business. "Our relationship with Nintendo underscores our unique position in the industry -- how we work together with clients to help them leverage IBM technology, intellectual property and research to drive innovation into their own core products."

Built on the open, scalable Power Architecture base, IBM custom processors exploit the performance and power advantages of proven silicon-on-insulator (SOI) technology. The inherent advantages of the technology make it a superior choice for performance-driven applications that demand exceptional, power-efficient processing capability – from entertainment consoles to supercomputers.


CericJune 07, 2011

So its 1/2880 as Powerful as Watson.

BlackNMild2k1June 07, 2011

There is an AMD press release too

if NWR is interested in posting it.

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